Definitions :

  • FIB : Focused Ion Beam
  • GDS : (Graphic Database System) Files used in the FIB equipment to navigate to a specific area in the integreted circuit
  • Circuit Edit : Technique used in new design flow modifications on integreted circuit; This technique can be applied to design optimization changes before final productionin, debugging process or solutions fixes 

Serma header

 
fib modif

        SERMA Main Strength

  • Fast turn around (standard within 3 Days)
  • Day night shift
  • Risk assessment
  • Optimization and checking of modification
  • Work on site possibility (Open Laboratory)
  • Data and sample security (pgp, safety box…)
  • Pre and post FIB support (sample prep, electrical characterization).
   

        Systems Strengths ?

  • Modification down to 28nm nodes
  • Frontside and backside Edit
  • Package, PCB and wafer up to 8’’
  • Type of interconnection (Cu, Al)
  • 0,5kV to 30kV beam energy
  • 1pA to 21nA current range
  • IR camera
V600         Chemistries available ?
  • Tungsten deposition (2 Ohms/o)
  • Oxide deposition (TEOS, TMCTS)
  • XeF2 (Dielectric & Si trenching)
  • I2 & Cl2  (Aluminum)
  • Water (Copper & Organics)
  • Dx (Copper, Deprocessing)
  • DE (Low-k dielectric)
     

        How ?

  • Metal lines cut
  • Metal lines rerouting
  • Selective etching for metal or dielectric
  • Conductive and dielectric deposition
  • Probe pads deposition
  • Cross-sectionning
  • Organics removal
modif3

      

        Main uses ?

  • Prototyping
  • Mask & IC modification
  • Problem solving
  • Failure analysis
  • Reverse engineering

                fib 24/24

 Circuit-Edit examples  
     

fib exemple1

gds

Using GDS files for navigation

fib exemple2
 

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Customer Service: csc@serma.com ; +33 (0)5 57 26 08 88